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 DISCRETE SEMICONDUCTORS
DATA SHEET
BAL74 High-speed diode
Product specification Supersedes data of 1999 May 26 2003 Dec 17
Philips Semiconductors
Product specification
High-speed diode
FEATURES * Small plastic SMD package * High switching speed: max. 4 ns * Continuous reverse voltage: max. 50 V * Repetitive peak reverse voltage: max. 50 V * Repetitive peak forward current: max. 500 mA. APPLICATIONS * High-speed switching in e.g. surface mounted circuits. DESCRIPTION The BAL74 is a high-speed switching diode fabricated in planar technology, and encapsulated in the small SOT23 plastic SMD package. MARKING TYPE NUMBER BAL74 Note 1. = p : Made in Hong Kong. = t : Made in Malaysia. = W : Made in China. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BAL74 - DESCRIPTION plastic surface mounted package; 3 leads MARKING CODE(1) JC* Fig.1
handbook, halfpage 2
BAL74
PINNING PIN 1 2 3 DESCRIPTION not connected anode cathode
1 1 n.c. 3 3
MAM230
2
Simplified outline (SOT23) and symbol.
VERSION SOT23
2003 Dec 17
2
Philips Semiconductors
Product specification
High-speed diode
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VRRM VR IF IFRM IFSM PARAMETER repetitive peak reverse voltage continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current square wave; Tj = 25 C prior to surge; see Fig.4 tp = 1 s tp = 1 ms tp = 1 s Ptot Tstg Tj Note 1. Device mounted on an FR4 printed-circuit board. ELECTRICAL CHARACTERISTICS Tj = 25 C unless otherwise specified. SYMBOL VF PARAMETER forward voltage see Fig.3 IF = 1 mA IF = 10 mA IF = 50 mA IF = 150 mA IR reverse current see Fig.5 VR = 50 V VR = 50 V; Tj = 150 C Cd trr Vfr diode capacitance reverse recovery time forward recovery voltage f = 1 MHz; VR = 0; see Fig.6 when switched from IF = 10 mA to IR = 10 mA; RL = 100 ; measured at IR = 1 mA; see Fig.7 CONDITIONS total power dissipation storage temperature junction temperature Tamb = 25 C; note 1 - - - - -65 - see Fig.2; note 1 CONDITIONS MIN. - - - -
BAL74
MAX. UNIT 50 50 215 500 V V mA mA
4 1 0.5 250 +150 150
A A A mW C C
MAX. UNIT 715 855 1 1.25 0.1 100 2 4 mV mV V V A A pF ns V
when switched from IF = 10 mA; tr = 20 ns; see Fig.8 1.75
THERMAL CHARACTERISTICS SYMBOL Rth(j-tp) Rth(j-a) Note 1. Device mounted on an FR4 printed-circuit board. PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS VALUE 330 500 UNIT K/W K/W
2003 Dec 17
3
Philips Semiconductors
Product specification
High-speed diode
GRAPHICAL DATA
BAL74
250 IF (mA) 200
msa562
handbook, halfpage
300
MBG382
IF (mA)
(1) (2) (3)
200
150
100
100
50
0 0 50 100 150 200 Tamb (C)
0
0
1
VF (V)
2
Device mounted on an FR4 printed-circuit board.
(1) Tj = 150 C; typical values. (2) Tj = 25 C; typical values. (3) Tj = 25 C; maximum values.
Fig.2
Maximum permissible continuous forward current as a function of ambient temperature.
Fig.3
Forward current as a function of forward voltage.
102 handbook, full pagewidth IFSM (A)
MBG704
10
1
10-1 1 10
102
103
tp (s)
104
Based on square wave currents; Tj = 25 C prior to surge.
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.
2003 Dec 17
4
Philips Semiconductors
Product specification
High-speed diode
BAL74
105 IR (nA)
(1) (2)
mbg377
handbook, halfpage
0.8
MBG446
Cd (pF) 0.6
104
103
0.4
102
0.2
10
0
0 100 Tj (C) 200
0
4
8
12
VR (V)
16
(1) VR = 50 V; maximum values. (2) VR = 50 V; typical values.
f = 1 MHz; Tj = 25 C.
Fig.5
Reverse current as a function of junction temperature.
Fig.6
Diode capacitance as a function of reverse voltage; typical values.
2003 Dec 17
5
Philips Semiconductors
Product specification
High-speed diode
BAL74
handbook, full pagewidth
tr D.U.T. 10% SAMPLING OSCILLOSCOPE R i = 50 VR 90%
tp t
RS = 50 V = VR I F x R S
IF
IF
t rr t
(1)
MGA881
input signal
output signal
(1) IR = 1 mA.
Fig.7 Reverse recovery time test circuit and waveforms.
I
1 k
450
I 90%
V
R S = 50
D.U.T.
OSCILLOSCOPE R i = 50 10%
MGA882
V fr
t tr tp
t
input signal
output signal
Fig.8 Forward recovery voltage test circuit and waveforms.
2003 Dec 17
6
Philips Semiconductors
Product specification
High-speed diode
PACKAGE OUTLINE
BAL74
Plastic surface mounted package; 3 leads
SOT23
D
B
E
A
X
HE
vMA
3
Q A A1
1
e1 e bp
2
wMB detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.9 A1 max. 0.1 bp 0.48 0.38 c 0.15 0.09 D 3.0 2.8 E 1.4 1.2 e 1.9 e1 0.95 HE 2.5 2.1 Lp 0.45 0.15 Q 0.55 0.45 v 0.2 w 0.1
OUTLINE VERSION SOT23
REFERENCES IEC JEDEC TO-236AB EIAJ
EUROPEAN PROJECTION
ISSUE DATE 97-02-28 99-09-13
2003 Dec 17
7
Philips Semiconductors
Product specification
High-speed diode
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
BAL74
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Dec 17
8
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R76/04/pp9
Date of release: 2003
Dec 17
Document order number:
9397 750 12388


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